The hot press uses pulse heating technology, with accurate temperature control. The temperature sampling frequency is 0.1s. Single working platform, rotary working platform, left and right mobile platform and other diversified working modes. Multi stage temperature rise control. Real time temperature curve display. Silicone tape indexing mechanism. CCD vision system provides accurate alignment. Mass program pre storage. Touch operation interface, program password protection.

Hot press is also called bonding machine. According to different hot pressing media, it can be divided into tin soldering, ACF (opposite conductive tape), ACP (opposite conductive glue) and TBF (hot melt adhesive film). It is applicable to the connection of FPC (flexible circuit board), HSC (zebra paper), TAB with LCD and PCB.