Copper plating is the most widely used pre coating in the electroplating industry, including tin solders, lead tin alloys, and zinc die castings. Before nickel, gold, and silver plating, copper is required to improve the adhesion of the coating.

During electroplating, the plated metal or other insoluble material is used as the anode, and the workpiece to be plated is used as the cathode. The cations of the plated metal are reduced on the surface of the workpiece to be plated to form a coating. In order to eliminate the interference of other cations and make the coating uniform and firm, it is necessary to use a solution containing the metal cations of the coating as the plating solution to maintain the concentration of the metal cations of the coating unchanged. The purpose of electroplating is to coat the substrate with a metal coating that changes the surface properties or dimensions of the substrate. Electroplating can enhance the corrosion resistance of metals (most plating metals use corrosion resistant metals), increase hardness, prevent abrasion, improve electrical conductivity, smoothness, heat resistance, and surface aesthetics.