Custom Liquid Cooling Plates for Optimizing Heat Transfer in Electronics

Intel Eagle-stream liquid cooling plate 700W×2

The unique heat dissipation design cleverly directs the water cooling liquid to

the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and

heat dissipation performance. Its unique flow path design ensures that the

coolant can flow efficiently.Evenly distributed on each heat dissipation surface,

thereby significantly improving heat dissipation efficiency. Compared with

traditional heat dissipation methods.Heat sinks and fans enhance heat

dissipation more effectively.

Small batch customization with quick proofing

》Efficient heat dissipation and noise control.

》Thermal design optimization, structural design.

》Apply solder and heat and solder.

》Drilling, welding, surface treatment and other processes.

》Seamless and perfect joint, no worries about leakage.

Model ：T-HS202309 Category：Intel CPU

Welding process：pure copper TLP welding heat source Total power：700W×2

Working environment：40°C,1.1LPM,25%EGW cold plate surface temperature：below64°C

flow resistance：Below16KPa Resistant to stress：1Mpa