Tin Ingot
Product description
Product Description
Pure tin ingots purity more than 99.95%
H.S. Code.:80011000
Weight: 25kg/bar
Physical character:
Atomic Weight: 118.69
Melting Point: mp: 232 °C
Boiling Point: bp: 2260 °C
Usage:
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
5, Packing:1MT per pallet, Total 20MT per 20'FCL
Content below:
metal | Sn | As | Fe | Cu | Pb | Bi | Sb | Cd | Ni | Zn | Al |
inspect | 99.95 | 0.029 | 0.0009 | 0.0042 | 0.012 | 0.006 | 0.015 | 0.0005 | 0.0007 | 0.0008 | 0.0008 |
Tin ingot is widely used as a coating material in High-precision electronic products, and other requirements of precision welding products, welding products, general electronics, food industry packaging, automotive and electrical industry, and high temperature resistant products.
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