Hot press includes constant temperature hot press, pulse hot press, double station hot press, double indenter pulse hot press, desktop hot press, etc. As the pitch of PCB or FPC in consumer electronic products tends to be smaller, the traditional soldering process has been difficult to meet the requirements of ultra-fine hot pressing. ACF process has been gradually applied by mobile phone designers.

Hot press is also called bonding machine. According to different hot pressing media, it can be divided into tin soldering, ACF (opposite conductive tape), ACP (opposite conductive glue) and TBF (hot melt adhesive film). It is applicable to the connection of FPC (flexible circuit board), HSC (zebra paper), TAB with LCD and PCB.