100mm 4 inch SiC Crystal Boule Supplier For laser cutting

Find 4-inch SiC as-cut wafers and SiC Boule manufacturers and suppliers in China, offering diameters of 100mm and 150mm. HMT provides 4-inch, 6-inch, and 8-inch SiC ingots for both test grade and production grade purposes. The test grade SiC crystal ingot can be utilized as a testing material for laser cutting machines, polishing machines, etc. Purchase the SiC Boule at a favorable price from HMT.

The main form of SiC in semiconductors is as a substrate material. SiC substrate is the cornerstone of GaN and SiC applications in the third generation semiconductor materials. SiC materials mainly grow SiC epitaxial layer on conductive SiC substrate, which is used in all kinds of power devices. In recent years, with the maturity of technology and the decrease of preparation cost, the application of SiC in the field of new energy continues to penetrate.

Cutting is the primary key process of SiC substrate preparation, determines the subsequent grinding, polishing processing level, the cost can account for more than 50%, this is because SiC is a hard material, hardness is only lower than diamond, cutting difficulty is very large, the current mainstream process is line saw cutting, there are also some manufacturers in the test laser cutting.